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EuroSys 2008 ACM SIGOPS Workshop on
Isolation and Integration in Embedded Systems (IIES 2008)
http://ess.cs.tu-dortmund.de/workshops/iies/
------------------------------ --- Call for Contributions --- ------------------------------
TOPICS ------
Embedded systems developers today are confronted with a large variety of challenges in the design and implementation of a system. Issues such as co-location of different applications on a single hard- or software platform ("co-habitation"), platform integration of different embedded operating environments as well as safety and protection of embedded software systems require novel approaches to embedded systems development as well as the adaptation of technologies from mainframe and desktop computing, like virtualization and emulation. This, in turn, will change traditional embedded design processes to include hardware and software of growing complexity.
This workshops aims to bring together researchers and developers from all areas of embedded systems in order to create a lively discussion of these novel approaches in integration and isolation of embedded systems and the associated challenges and prospects.
Suggested topics for papers and discussion include, but are not restricted to:
- Virtualization in embedded systems - System support for temporal and spatial isolation of system-level and application code in embedded systems - Interaction and resource sharing between isolated components - System- and language-based isolation techniques - Configurable isolation mechanisms - Lightweight address space models for isolation and similar architectural ffeatures - Isolation mechanisms and resource constraints -- memory, energy, performance - Optimization of complex co-habitated embedded systems - Platform integration of embedded systems - Preservation of temporal constraints in isolated and integrated systems - Integration of legacy embedded systems in new designs - Experience reports and details on performance, energy and cost evaluations
SUBMISSION GUIDELINES ---------------------
Prospective participants of the workshop are asked to submit a position paper or experience report (3 to 6 pages). Submission of industry papers is particularly encouraged. All papers must be written in English. The papers should be submitted in PDF format by January 31st, 2008. Detailed submission instructions can be found at the workshop web site.
Attendance to the workshop is limited to facilitate lively discussions. Participation will be by invitation only, based on the program committee's evaluation of the submission. Accepted participants will be notified by February 28th, 2008.
Accepted position papers will be distributed among the participants electronically prior to the workshop. More detailed information will be available at the IIES home page.
Camera-ready versions of all accepted papers have to be submitted by March 13th, 2008. Detailed instructions will be emailed to the authors.
IMPORTANT DATES ---------------
January 31, 2008 -- position paper submission by email
February 28, 2008 -- notification of acceptance
March 13, 2008 -- submission of camera-ready versions
WORKSHOP PREPARATION AND FORMAT -------------------------------
This workshop will be highly interactive. Accepted papers will be posted on the workshop website ahead of the venue and participants are expected to familiarize themselves with the topics presented. In particular, participants should prepare questions, comments and a list of suggested improvements for the authors of topics they are interested in.
To prepare a special collaborative work session the organizers will use the position papers and the input by the participants to compile a list of questions, which will be discussed and answered during the workshop in discussion groups. The list can be extended or changed during the workshop, if the discussion brings up additional interesting questions.
PUBLICATION -----------
Presented papers will be published electronically on the workshop web page and in a printed version as a technical report.
ORGANIZATION ------------
Michael Engel, University of Dortmund, Germany Olaf Spinczyk, University of Dortmund, Germany